Presentation Transcripts
Latest Update : Dec.6, 2023
Back to Financial Results (FY3/2024)
Investor Meeting Presentation for 2Q FY 3/2024 held on November 2, 2023
- Cover
- Today's Agenda
- Financial Results
- Summary of Consolidated Business Results for 2Q
- Summary of Consolidated Business Results for 1H
- Net Sales, Operating Income / Margin
- 2Q Actual: Differences from the Forecast as of August
- Precision Technologies (PT)
- Motor, Lighting & Sensing (MLS)
- Semiconductors & Electronics (SE)
- Access Solutions (AS)
- Profit Attributable to Owners of the Parent / EPS
- Inventory
- Net Interest-bearing Debt / Free Cash Flow
- Forecast
- Forecast for Business Segment
- Full-year Operating Income: Differences from the Initial Forecast
- Management Policy & Business Strategy
- Summary
- Key Points of FY3/24 Forecast
- Business Acquisition of Hitachi Power Semiconductor Device, LTD.
- Expansion of the Power Semiconductor Business through the Acquisition of Hitachi Power Semiconductor Device Business (1)
- Expansion of the Power Semiconductor Business through the Acquisition of Hitachi Power Semiconductor Device Business (2)
- Access Solutions Segment (AS)
- FY3/25 Operating Income Image
- Signs of Bottoming Out
- ESG Topics (1)
- ESG Topics (2)
- Shareholders Return
- Forward-looking Statements
- Reference
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We believe the integration synergies described here represent an excellent opportunity to dramatically strengthen our semiconductor business.
The first point is that because we have already been engaged in a contract manufacturing as a Fab, we are already in the process of conducting integration preparation activities today.
In terms of human resources, there are IGBT and SiC engineers. We were able to acquire a total of 400 analog semiconductor engineers consisting of 150 from MITSUMI, 100 from ABLIC, and 150 from Hitachi Power Semiconductor Device.
The most significant synergy comes from the post-processing capability that Hitachi Power Semiconductor Device possesses. Moreover, Hitachi Power Semiconductor Device possesses packaging technology that is more advanced than ours and module technology that we did not have. We believe that this business integration will create synergies.
In addition, they have proprietary Side Gate technology for IGBTs, instead of the conventional Trench Gate, characterized by 25-30% higher performance than other ICs, and we are currently launching this IGBT at our Shiga Plant.
With regard to the target markets, the most important are transportation equipment and power grids, and automobiles are not in the center of our scope. As I mentioned earlier, we are not considering a strategy of mass supply to large markets. We believe that if we can achieve the synergies described here on the slide, we will be able to fully achieve the objectives of this business integration.
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