2017

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image : The New Value Creation Which MinebeaMitsumi Aims for by Leveraging the Synergy of Business Integration

(Posted Oct. 2017)

Exercising the Synergy of Integration

(Left) Michiya Kagami  Director, Managing Executive Officer Chief of Engineering Headquarters  (Right) Hiroshi Aso Director, Managing Executive Officer Deputy Chief of Engineering Headquarters Managing Executive Officer of MITSUMI ELECTRIC CO., LTD.

(Left) Michiya Kagami
Director, Managing Executive Officer
Chief of Engineering Headquarters
(Right) Hiroshi Aso
Director, Managing Executive Officer
Deputy Chief of Engineering Headquarters
Managing Executive Officer of
MITSUMI ELECTRIC CO., LTD.

Kagami: A good example of products where we can readily produce synergy are the sensors required for the future IoT*1 society. Minebea boasted among the highest volume of strain gage production globally, while Mitsumi possessed a line-up of sensors utilizing MEMS*2 technology. By combining our sensors, developed through different approaches, we believe that we can gain an advantage unmatched by our competitors.

Aso: We will certainly be able to leverage the strengths of the two companies in force sensors, which measure load. In addition, we will also be able to propose products which utilize sensors developed by Mitsumi for temperature, humidity, and airflow. For example, we could combine them with back lights and actuators, which are Minebea's specialty.

Kagami: Because Minebea produces various output devices, if we are able to successfully combine these with sensors, which are input devices, we can easily produce composite products and thereby achieve synergy.

Aso: Exactly. In addition, we will also attempt to apply technology from Mitsumi's semiconductor business for the control of motor products manufactured by Minebea to produce further synergy.

*1 Internet of Things: Connecting of various physical devices via the Internet.

*2 Micro Electro Mechanical Systems: Devices with micro-level construction comprised of sensors, actuators, electrical circuits and other mechanical elements assembled upon the silicon, glass, or organic material bases of conductors.

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